How to replace the fail pin on the probe card

专利摘要:
The present invention relates to a method for replacing a fail pin of a probe card for replacing a test pin, which has failed, by using a melting point of epoxy, when testing a wafer using a probe card. Compensating with a tweezers to remove the support of the pin and remove the fail pin after melting the epoxy by heating at a temperature below a certain temperature with a soldering iron of 60 Watt (W) for a predetermined time; Inserting a new test pin having the same diameter, length, and angle as the fail pin; Soldering the inserted test pins so that they are aligned with the coupling support to be accurately positioned and fixed around the epoxy and the inserted top pins; After the soldering, the step of cleaning the alignment surface, leakage current contact resistance, etc. are included.
公开号:KR19980058492A
申请号:KR1019960077817
申请日:1996-12-30
公开日:1998-10-07
发明作者:이민호
申请人:김영환；현대전자산업 주식회사；
IPC主号:

专利说明:

How to replace the fail pin on the probe card
The present invention relates to a method for replacing a fail pin of a probe card, and more particularly, when a wafer is tested using a probe card, replacing a test pin having a fail using a melting point of epoxy. It relates to a method of replacing the fail pin of the probe card.
In general, in the case of probe testing each die on a wafer, a probe card that delivers an electrical signal to a memory or logic test system has been used.
The probe card is used by accurately contacting a plurality of pins fixed with epoxy on a circular or rectangular printed circuit board (PCB) to a bonding pad of a die to be tested.
A structure of a general probe card test pin will be described with reference to FIG. 1.
Referring to FIG. 1, a test pin of a general probe card is connected to a test pin 3 and a coupling support 1 by a coupling pin 2.
However, in the case of the probe card test pin as described above, if only one of the fail pins is generated, it is difficult to replace the pins, and when the pins are replaced, the ratio of epoxy is not constant, so the epoxy is cracked, and the coating of the pin is unstable. Even if a little heat is applied, the coating film is peeled off and soldering is not possible, so there is a problem in that the probe card cannot be used.
Therefore, the present invention is to solve this problem, if the test pin is failed when testing the wafer using the probe card, the probe card that can be replaced with a new pin using the melting point of the epoxy to proceed with the wafer test again Its purpose is to provide a replacement method for the fail pin.
1 is a cross-sectional view showing the structure of a typical probe card test pin.
2A and 2B are cross-sectional views illustrating fail pins and top pins according to an embodiment of the present invention;
* Explanation of symbols for the main parts of the drawings
1: bonding support, 2: bonding pin, 3: test pin, 4: epoxy, 5: fail pin
The method of replacing the fail pin of the probe card of the present invention to achieve the above object is to bend or 휜 correct the fail pin of the probe card with tweezers to remove the support of the fail pin and to maintain a constant time of 60 Watts (W) in the iron Heating to below temperature to remove the fail pins after melting the epoxy; Inserting a new test pin having the same diameter, length, and angle as the fail pin; Aligning the inserted test pins with the coupling support to accurately position and fix the epoxy and the fixed pins around the inserted top pins to perform soldering; After the soldering, the alignment surface, characterized in that it comprises a step of washing to accurately check the leakage current contact resistance.
EXAMPLE
Hereinafter, preferred embodiments of the present invention will be described with reference to FIGS. 2A and 2B.
FIG. 2A shows the fail pin 5 which is bent or warped at the end inserted into the epoxy 4.
2B shows a case where the test pin 3 inserted in the epoxy 4 is normal.
When the fail pin 5 is generated as in FIG. 2A, a method for inserting the normal test pin 3 into the epoxy 2 as shown in FIG. 2B will be described.
Bent or 휜 calibrate the fail pin (5) of the probe card with tweezers to remove the support (1) of the fail pin (5), and use the iron having a 60-watt power to the fail pin (5) for 20 to 30 seconds. While the heat is applied to 200 ℃ or less to allow the epoxy (4) to be melted, and then to remove the fail pin (4) using tweezers to prevent cracking in the epoxy (4).
Remove the fail pin (5) and select a new normal test pin (3) with the same diameter, length, and angle as the fail pin (5), and remove the fail pin (5) from the opposite side of the normal test pin (3). Insert it into place.
After inserting the new test pin (3), bring the newly inserted test pin (3) upwards to the virtual coupling support (1), and then align the wafer support coupling (1) on the probe card repair device. Position and apply the adhesive around the epoxy (4) and the inserted top pin (3) to fix and solder the top pin (3).
After soldering, ultrasonic cleaning is performed with alcohol after calibration to accurately check the alignment surface, leakage current and contact resistances.
Therefore, after replacing the normal test pin 3 with the fail pin 5 by the above process, the wafer test can be performed again.
As described above, the method for replacing the fail pin of the probe card of the present invention is to replace the fail pin with the normal pin using the melting point of epoxy when the wafer is tested and a fail occurs in the probe card pin. The test can be run again, and the cost of testing can be reduced by not changing expensive probe cards.

权利要求:
Claims (5)
[1" claim-type="Currently amended] Correcting the bent pin or the pin pin of the probe card by tweezers to remove the support of the pin pin and removing the pail pin after melting the epoxy by heating at a temperature below a certain temperature with a 60-watt iron for a predetermined time; Inserting a new test pin having the same diameter, length, and angle as the fail pin; Aligning the inserted test pin with the coupling support so as to accurately position and fix the epoxy pin around the top pin inserted with the epoxy to perform soldering; After the soldering, the alignment surface, the method of replacing the fail pin of the probe card, characterized in that it comprises the step of washing to accurately check the leakage current contact resistance.
[2" claim-type="Currently amended] The method of claim 1, wherein the pail pin is heated to 200 ° C. or lower for 20 to 30 seconds using a 60-watt iron and removed after the epoxy melts.
[3" claim-type="Currently amended] The method of claim 1, wherein when the normal pin is inserted, the fail pin replacement method of the probe card is inserted from an opposite portion of the normal pin.
[4" claim-type="Currently amended] 12. The method of claim 1, wherein an adhesive is used to fix the top pin for soldering.
[5" claim-type="Currently amended] The method of claim 1, wherein the ultrasonic wave is cleaned with alcohol to inspect the alignment surface, the leakage current, and the contact resistance after soldering.

类似技术:

---

公开号 | 公开日 | 专利标题

---

US5905382A|1999-05-18|Universal wafer carrier for wafer level die burn-in

---

KR100793506B1|2008-01-14|Segmented contactor

---

JP2648696B2|1997-09-03|DUT board mounting system

---

US6094060A|2000-07-25|Test head for applying signals in a burn-in test of an integrated circuit

---

US5571027A|1996-11-05|Non-destructive interconnect system for semiconductor devices

---

US9310428B2|2016-04-12|Probe retention arrangement

---

DE112006001477B4|2012-04-26|Probe card

---

US6523255B2|2003-02-25|Process and structure to repair damaged probes mounted on a space transformer

---

US9093238B2|2015-07-28|Fuse for interrupting a voltage and/or current-carrying conductor in case of a thermal fault and method for producing the fuse

---

US5949242A|1999-09-07|Method and apparatus for testing unpackaged semiconductor dice

---

JP5426161B2|2014-02-26|Probe card

---

KR100828053B1|2008-05-09|Probe guard

---

US5530376A|1996-06-25|Reusable carrier for burn-in/testing of non packaged die

---

US6756797B2|2004-06-29|Planarizing interposer for thermal compensation of a probe card

---

EP0720226A2|1996-07-03|Semiconductor device comprising contact bumps

---

JP5180216B2|2013-04-10|Attachment of electrical elements to electronic devices using conductive materials

---

US5705933A|1998-01-06|Resuable carrier for burn-in/testing on non packaged die

---

TWI264548B|2006-10-21|Electronic component/interface interposer

---

JP2006010629A|2006-01-12|Probe card having parallel adjustment mechanism

---

US20080122433A1|2008-05-29|Pressing member and electronic component handling device

---

US5468157A|1995-11-21|Non-destructive interconnect system for semiconductor devices

---

US5517125A|1996-05-14|Reusable die carrier for burn-in and burn-in process

---

US6573743B2|2003-06-03|Testing apparatus for test piece, testing method, contactor and method of manufacturing the same

---

JPH0619371B2|1994-03-16|Electrical connector

---

US8091222B2|2012-01-10|Method for forming an adapter apparatus using curable material

同族专利:

---

公开号 | 公开日

---

引用文献:

---

公开号 | 申请日 | 公开日 | 申请人 | 专利标题

---

法律状态:
1996-12-30|Application filed by 김영환, 현대전자산업 주식회사

---

1996-12-30|Priority to KR1019960077817A

---

1998-10-07|Publication of KR19980058492A

优先权:

---

申请号 | 申请日 | 专利标题

---

KR1019960077817A|KR19980058492A|1996-12-30|1996-12-30|How to replace the fail pin on the probe card|